UBP Pro V0.8 64 Bit
UBP Pro V0.8 64 Bit https://tiurll.com/2sC7tL
UBP Pro Win 10 PE Multiboot v0.7 | Hiren's Boot CD. 4GB of RAM, the following parameters:. If you are using a smaller amount of RAM, you will need to 5.65 Gb.1. Field of the Invention
The present invention relates to an ink-jet head assembly having a piezoelectric substrate and a method for manufacturing the same.
2. Description of the Related Art
A thermal ink jet printer which is a representative example of a conventional ink-jet head will be described. This thermal ink jet printer records characters and graphics onto a recording medium using a printhead formed by thermally fusing ink in a flow path of ink which is connected to an ink reservoir in response to the application of heat through a heating resistor provided on the surface of the printhead.
The printhead has a heat-generating resistor formed of, for example, a thin film of tantalum nitride or tantalum. The printhead is constituted by providing a plurality of heating resistors on a ceramic substrate. In general, the ceramic substrate is of a laminated structure in which at least one ceramic layer having a large number of through-holes is laminated on a base layer made of alumina (Al.sub.2 O.sub.3), silicon (Si), or the like. A protective layer of alumina, alumina-titania (Al.sub.2 O.sub.3 -TiO.sub.2), or the like is formed on the surface of the substrate. The protective layer prevents the surface of the substrate from being contaminated or damaged by the ink. The ink is supplied from an ink reservoir to a flow path provided on the surface of the substrate through a number of through-holes formed in the substrate.
As the protective layer of the ceramic substrate, a layer of alumina or alumina-titania is formed on the surface of the substrate by vapor deposition and a heat treatment is conducted for the layer. As a result, the protective layer is bonded to the substrate by way of a strong chemical bond.
However, since the ceramic substrate is of a laminated structure formed by laminating a number of ceramic layers, the substrate is very fragile. Therefore, when the substrate is mounted on a printed circuit board, it is necessary to use a special adhesive agent such as a conductive adhesive agent. In addition, a heater is connected to the ceramic substrate by wire bonding, thereby lowering the 0b46394aab